Principle of laser etching technology
The basic principle of laser etching is to focus the low-power laser beam with high beam quality (generally ultraviolet laser, optical fiber laser) into a tiny spot, and form a high power density at the focal point, so that the material vaporizes and evaporates instantly, forming holes, holes and grooves. The processing technology includes laser micro-nano cutting, cutting, etching, drilling and so on.
Features of laser etching technology
Laser etching is the use of the characteristics of laser non-contact processing, high degree of flexibility, processing speed, no noise, small heat affected zone, can be focused to level laser wavelength tiny spot such as superior processability, good drilling, scribing, etching and cutting size precision and machining quality, especially the interaction with some materials (such as polyimide) belongs to "photochemical effect" of the "cold", no effect of carbide can be obtained, they are widely used in electronic semiconductor materials processing.
Typical application of uv laser etching technology
1) application of thin film laser etching
Advantages:
High repetition rate, high power
Fast material removal rate
No chemical corrosion to the environment pollution
ITO coating laser etcher is a precision equipment that implements electrode etching processing on ITO Glass and ITO Film by laser. It can be used on ITO coating film, polycrystalline film and other oxide films on glass and PET substrate for a wide range of patterns and various sizes of precise, high-speed etching and processing of various electrodes. Especially suitable for mobile phone touch screen electrode etching.
2) application of solar cell laser scribing
Advantages:
The machine has reasonable structure, high precision, high speed, complete function, stable and reliable performance index, low failure rate, high rate of finished products in contactless processing and wide application
Easy to operate, can work continuously for 24 hours, energy saving and environmental protection
Graphical user interface (GUI), friendly man-machine interface, can display the cutting track in real time, simple and intuitive operation
Optional image automatic recognition processing and positioning functions
Solar cells are devices that directly convert light energy into electricity by means of photoelectric or photochemical effects. Thin film solar cell production process: prepare substrate conductive glass (TCO) - glass edge grinding - glass cleaning - 1064 laser marking - secondary cleaning, loading fixture temperature preheating, cooling discharge PECVD deposition of amorphous silicon membrane technique, fixture - 635 laser marking - PVD magnetron sputtering AL - 635 laser marking - test - aging - laser clear edge - three times cleaning - welding electrode wire - laminated - border. The thin film solar cell can be sliced by laser. Non-contact machining can avoid the stress caused by blade machining, which can effectively improve the rate of excellent products of silicon chip and chip, and also greatly improve the quality of battery chip marking. CCD image processing system is optional to realize the precise marking of special battery.
3) laser edge cleaning
Advantages:
Do not need to use any chemicals and cleaning fluid, green environmental protection
Non-contact cleaning, no mechanical force, no deformation, high efficiency, save time
Can achieve the conventional cleaning can not reach the cleanliness
It is also possible to selectively clean material surface contaminants without damaging the material surface
Laser edge cleaning speed is fast and pollution-free, through the interface friendly special control software, can be completed multiple laser simultaneous work. It can be used for cutting insulation, cleaning and cleaning of coating around amorphous silicon thin film solar panels.